{
  "title": "Semiconductor device data for AI wafer and die-map evidence",
  "source_page": "https://fiund.com/industries/semiconductor-wafer-die-test-map-data",
  "authorship": "Original fictional Fiund editorial exercise. No actual operating records or third-party source assets are included.",
  "example": {
    "title": "Translate row and column without inventing a second die",
    "context": "An original paper wafer grid uses a notch and numbered cells. No fabrication information or real test results appear.",
    "records": [
      [
        "1",
        "Coordinate glossary",
        "In image B the 180° rotation maps board row r to 5−r and column c to 5−c on a 4×4 grid."
      ],
      [
        "2",
        "Test map",
        "Toy indication at board row 1, column 3."
      ],
      [
        "3",
        "Image B",
        "Visible annotation at image row 4, column 2."
      ]
    ],
    "question": "Are these records consistent with one location?",
    "answer": "Yes. Applying record 1 to board row 1 and column 3 yields image row 4 and column 2, matching record 3. Keep one location with two coordinate frames rather than counting two separate indications. The notch documents which transform was used.",
    "failureModes": [
      "Comparing untransformed coordinates",
      "Swapping row and column during rotation"
    ],
    "fields": [
      [
        "board_die_coordinate",
        "Stable location key"
      ],
      [
        "image_coordinate",
        "Stores view-specific annotation"
      ],
      [
        "transform_version",
        "Makes the mapping auditable"
      ]
    ],
    "holdout": "Use a mirrored instead of rotated view and require applying its distinct transform.",
    "boundary": "Paper grid only; no wafer layouts, semiconductor recipes, production data or yield claims."
  }
}